Mitigation of edge degradation in ferroelectric memory devices through plasma etch clean

ABSTRACT

A ferroelectric memory device is fabricated while mitigating edge degradation. A bottom electrode is formed over one or more semiconductor layers. A ferroelectric layer is formed over the bottom electrode. A top electrode is formed over the ferroelectric layer. The top electrode, the ferroelectric layer, and the bottom electrode are patterned or etched. A dry clean is performed that mitigates edge degradation. A wet etch/clean is then performed.

This patent application claims priority from U.S. patent applicationSer. No. 11/442,810, filed May 30, 2006, the entireties of which areincorporated herein by reference.

FIELD OF THE INVENTION

The present invention relates generally to the field of integratedcircuit processing, and more particularly, to fabrication offerroelectric memory devices employing a dry clean to mitigate edgedegradation.

BACKGROUND OF THE INVENTION

Several trends exist, today, in the semiconductor device fabricationindustry and the electronics industry. Devices are continuously gettingsmaller and smaller and requiring less and less power. A reason for thisis that more personal devices are being fabricated which are very smalland portable, thereby relying on a small battery as its supply source.For example, cellular phones, personal computing devices, and personalsound systems are devices which are in great demand in the consumermarket. In addition to being smaller and more portable, personal devicesare requiring more computational power and on-chip memory. In light ofall these trends, there is a need in the industry to provide acomputational device which has a fair amount of memory and logicfunctions integrated onto the same semiconductor chip. Preferably, thismemory will be configured such that if the battery dies, the contents ofthe memory will be retained. Such a memory device which retains itscontents while a signal is not continuously applied to it is called anon-volatile memory. Examples of conventional non-volatile memoryinclude: electrically erasable, programmable read only memory (“EEPROM”)and FLASH EEPROM.

A ferroelectric memory (FeRAM) is a non-volatile memory which utilizes aferroelectric material, such as SBT or PZT, as the capacitor dielectricsituated between a bottom electrode and a top electrode. Both read andwrite operations are performed for a FeRAM. The memory size and memoryarchitecture affect the read and write access times of a FeRAM.

The non-volatility of an FeRAM is due to the bi-stable characteristic ofthe ferroelectric memory cell. One type of FeRAM is a single capacitormemory cell (referred to as a 1T/1C or 1C memory cell), which mayrequire less silicon area (thereby increasing the potential density ofthe memory array), but can be less immune to noise and processvariations. Additionally, a 1C cell requires a voltage reference fordetermining a stored memory state. Another type of FeRAM is a dualcapacitor memory cell (referred to as a 2T/2C or 2C memory cell), whichtypically requires more silicon area, and it stores complementarysignals allowing differential sampling of the stored information.

As illustrated in prior art FIG. 1, a 1T/1C FeRAM cell 10 includes onetransistor 12 and one ferroelectric storage capacitor 14. A bottomelectrode of the storage capacitor 14 is connected to a drain terminal15 of the transistor 12. The 1T/1C cell 10 is read from by applying asignal to the gate 16 of the transistor (word line WL) (e.g., the Ysignal), thereby connecting the bottom electrode of the capacitor 14 tothe source of the transistor (the bit line BL) 18. A pulse signal isthen applied to the top electrode contact (the plate line or drive lineDL) 20. The potential on the bit line 18 of the transistor 12 is,therefore, the capacitor charge divided by the bit line capacitance.Since the capacitor charge is dependent upon the bi-stable polarizationstate of the ferroelectric material, the bit line potential can have twodistinct values. A sense amplifier (not shown) is connected to the bitline 18 and detects the voltage associated with a logic value of either1 or 0. Frequently the sense amplifier reference voltage is aferroelectric or non-ferroelectric capacitor connected to another bitline that is not being read. In this manner, the memory cell data isretrieved.

A characteristic of the shown ferroelectric memory cell is that a readoperation is destructive. The data in a memory cell is then rewrittenback to the memory cell after the read operation is completed. If thepolarization of the ferroelectric is switched, the read operation isdestructive and the sense amplifier must rewrite (onto that cell) thecorrect polarization value as the bit just read from the cell. This issimilar to the operation of a DRAM. The one difference from a DRAM isthat a ferroelectric memory cell will retain its state until it isinterrogated, thereby eliminating the need of refresh.

As illustrated, for example, in prior art FIG. 2, a 2T/2C memory cell 30in a memory array couples to a bit line 32 and an inverse of the bitline (“bit line-bar”) 34 that is common to many other memory types (forexample, static random access memories). Memory cells of a memory blockare formed in memory rows and memory columns. The dual capacitorferroelectric memory cell comprises two transistors 36 and 38 and twoferroelectric capacitors 40 and 42, respectively. The first transistor36 couples between the bit line 32 and a first capacitor 40, and thesecond transistor 38 couples between the bit line-bar 34 and the secondcapacitor 42. The first and second capacitors 40 and 42 have a commonterminal or plate (the drive line DL) 44 to which a signal is appliedfor polarizing the capacitors.

In a write operation, the first and second transistors 36 and 38 of thedual capacitor ferroelectric memory cell 30 are enabled (e.g., via theirrespective word line 46) to couple the capacitors 40 and 42 to thecomplementary logic levels on the bit line 32 and the bar-bar line 34corresponding to a logic state to be stored in memory. The commonterminal 44 of the capacitors is pulsed during a write operation topolarize the dual capacitor memory cell 30 to one of the two logicstates.

In a read operation, the first and second transistors 36 and 38 of thedual capacitor memory cell 30 are enabled via the word line 46 to couplethe information stored on the first and second capacitors 40 and 42 tothe bar 32 and the bit line-bar line 34, respectively. A differentialsignal (not shown) is thus generated across the bit line 32 and the bitline-bar line 34 by the dual capacitor memory cell 30. The differentialsignal is sensed by a sense amplifier (not shown) that provides a signalcorresponding to the logic level stored in memory.

One problem encountered by ferroelectric memory is signal degradationduring read and write operations. The signal degradation can result insense amplifiers being unable to determine storage states for affectedferroelectric memory cells. As a result, such ferroelectric memory cellscan become unusable.

SUMMARY OF THE INVENTION

The following presents a simplified summary in order to provide a basicunderstanding of one or more aspects of the invention. This summary isnot an extensive overview of the invention, and is neither intended toidentify key or critical elements of the invention, nor to delineate thescope thereof. Rather, the primary purpose of the summary is to presentsome concepts of the invention in a simplified form as a prelude to themore detailed description that is presented later.

Aspects of the present invention facilitate ferroelectric memory deviceoperation and fabrication by mitigating edge degradation offerroelectric memory cells, which can result in signal degradation,reduced polarization, and/or failure. Aspects of the present inventionemploy a plasma based dry clean during and/or after ferroelectric stacketching, which can mitigate edge defects and performance degradation offabricated ferroelectric memory cells.

In accordance with an aspect of the invention, a method of forming aferroelectric memory device is disclosed. A bottom electrode diffusionbarrier layer is formed over one or more semiconductor layers, such asan interlevel dielectric layer. A bottom electrode layer is then formedover the bottom electrode diffusion barrier layer. A ferroelectric layeris formed over the bottom electrode. A top electrode is formed over theferroelectric layer. The top electrode, the ferroelectric layer, and thebottom electrode are patterned or etched. A dry clean is performed thatmitigates edge degradation. The dry clean can remove debris and formresidual compounds for later removal. A wet etch/clean is then performedthat can remove the residual compounds.

To the accomplishment of the foregoing and related ends, the inventioncomprises the features hereinafter fully described and particularlypointed out in the claims. The following description and the annexeddrawings set forth in detail certain illustrative aspects andimplementations of the invention. These are indicative, however, of buta few of the various ways in which the principles of the invention maybe employed. Other objects, advantages and novel features of theinvention will become apparent from the following detailed descriptionof the invention when considered in conjunction with the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a prior art schematic diagram illustrating an exemplary 1T/1CFeRAM memory cell.

FIG. 2 is a prior schematic diagram illustrating an exemplary 2T/2CFeRAM memory cell.

FIG. 3A is a cross sectional view of a ferroelectric memory device afteretching of a ferroelectric stack.

FIG. 3B is another view of the ferroelectric memory device of FIG. 3A.

FIG. 4 is a flow diagram illustrating a method of fabricating aferroelectric memory device in accordance with an aspect of the presentinvention.

FIG. 5 is a flow diagram illustrating a method of fabricating aferroelectric memory device in accordance with an aspect of the presentinvention.

FIG. 6A is a cross sectional view of a ferroelectric memory device at astage of fabrication in accordance with an aspect of the present.

FIG. 6B is another cross sectional view of a ferroelectric memory deviceat a stage of fabrication in accordance with an aspect of the presentinvention is provided.

FIG. 6C is yet another cross section view of a ferroelectric memorydevice at a stage of fabrication in accordance with an aspect of thepresent invention.

FIG. 6D is another cross section view of a ferroelectric memory deviceat a stage of fabrication in accordance with an aspect of the presentinvention.

FIG. 6E is yet another cross section view of a ferroelectric memorydevice at a stage of fabrication in accordance with an aspect of thepresent invention.

DETAILED DESCRIPTION OF THE INVENTION

The present invention will now be described with respect to theaccompanying drawings in which like numbered elements represent likeparts. The figures provided herewith and the accompanying description ofthe figures is merely provided for illustrative purposes. One ofordinary skill in the art should realize, based on the instantdescription, other implementations and methods for fabricating thedevices and structures illustrated in the figures and in the followingdescription.

Aspects of the present invention facilitate ferroelectric memory deviceoperation and fabrication by mitigating edge degradation offerroelectric memory cells, which can result in signal degradation,reduced polarization, and/or failure. Aspects of the present inventionemploy a plasma based dry clean during and/or after ferroelectric stacketching, which can mitigate edge defects and performance degradation offabricated ferroelectric memory cells.

FIG. 3A is a cross sectional view of a ferroelectric memory device 300after etching of a ferroelectric stack. The device 300 is provided forillustrative purposes and is provided as an example.

The device 300 includes one or more semiconductor layers 302 along witha wordline 306 formed therein. The semiconductor layers 302 can includea semiconductor substrate or body and/or interlayer dielectric layers.In one example, the layers 302 are comprised of silicon dioxide.However, other compositions of the layers 302 are possible.

A barrier layer or metal 304 surrounds the wordline 306 and can, forexample, facilitate contact resistance, adhesion, and the like. Thewordline 306 is comprised of a conductive material, such as tungsten(W).

A bottom electrode diffusion barrier 308 is located over the layers 302and a bottom electrode 310 is located on the bottom electrode diffusionbarrier 308. The bottom electrode 310 is comprised of conductivematerial, such as a noble metal, for example, iridium (Ir). Thediffusion barrier 308 is present to mitigate diffusion of materials,such as dopants, from underlying layers into the bottom electrode 310.

A ferroelectric layer 312 is located on the bottom electrode 310. Theferroelectric layer 312 is comprised of a ferroelectric material, suchas Pb(Zr,Ti)O₃ PZT (lead zirconate titanate), doped PZT with donors (Nb,La, Ta) acceptors (Mn, Co, Fe, Ni, Al) and/or both, PZT doped andalloyed with SrTiO3, BaTiO3 or CaTiO3, strontium bismuth tantalate (SBT)and other layered perovskites such as strontium bismuth niobatetantalate (SBNT) or bismuth titanate, BaTiO3, PbTiO3, Bi2TiO3 etc.

A top electrode 314 is located on the ferroelectric layer 312. The topelectrode 314 is comprised of a conductive material, such as, forexample, iridium (Ir), iridium oxide (IrO₂), and the like. A hardmask316 is located on the top electrode and facilitates etching of theferroelectric stack, which comprises the top electrode 314, theferroelectric layer 312, the bottom electrode 310, and the bottomelectrode diffusion barrier 308.

As an example, the device 300 can be read by applying a signal to thebottom electrode 310 and a pulse to the top electrode 314, and thensensing or measuring charge to determine a polarization state of thedevice.

However, the inventors of the present invention note that defects,contamination, degradation, and the like due to fabrication process(es)can degrade the performance of the ferroelectric. The degradedperformance can lead to device failures, reduced operational lifetimes,loss of data integrity, slower performance, and the like.

For example, separation voltages between polarization states (“0” and“1”) can decrease below allowable levels. Outer ferroelectric cells offerroelectric memory arrays can be particularly susceptible to suchseparation voltage shrinking. As a result, outer edge cells of an arraycan have lower separation voltages lower than other cells within thearray. This can be problematic for reading and writing from and to cellsof the array.

FIG. 3B is another view of the ferroelectric memory device 300. Here,conductive residue 318 has attached to lateral edges of theferroelectric stack. The conductive residue 318 can short or provide alow contact resistance path between the top electrode 314 and the bottomelectrode 310. This condition is also referred to a bit clamping orclamped bits, particularly when cells are unreadable.

Conventional fabrication techniques tend to have a number of similarlydegraded ferroelectric memory cells after fabrication. Typically, thedefective cells are located on or near outer edges of an array.

Aspects of the present invention employ a dry clean operation duringand/or after etching of the ferroelectric stack in order to mitigatedegradation of ferroelectric devices, such as the device 300. The dryclean operation can, for example, remove the conductive residue 318 andprevent shorting of the top electrode 314 and the bottom electrode 310.

As a result, separation voltages can be more uniform across an array offerroelectric memory cells. In particular, shrinkage of separationvoltages for outer edge cells can be mitigated by performing the dryclean operation of aspects of the present invention.

FIG. 4 is a flow diagram illustrating a method 400 of fabricating aferroelectric memory device in accordance with an aspect of the presentinvention. The method 400 employs a dry clean after etching of theferroelectric stack in order to mitigate performance degradation and/orfailure of ferroelectric memory cells.

It is appreciated that portions of the method 400 can be performed in anorder varied from that introduced below. Additionally, other portions ofthe detailed description can be referenced for additional detail andsupport of the method 400. Furthermore, it is noted that processes inaddition to those described can be employed in formation of theferroelectric memory device and that some of the blocks below can beomitted in alternate aspects of the invention.

Beginning at block 402, an interlevel dielectric layer is formed on/overa semiconductor body or substrate and contacts are formed in theinterlevel dielectric layer. The contacts are comprised of a conductivematerial, for example, tungsten (W) contacts, and are typically formedtherein with a barrier layer, such as TiN, disposed there between toavoid oxidation of the contacts.

A bottom electrode diffusion barrier layer is formed over the interlayerdielectric at block 404. The diffusion barrier layer is electricallyconductive and mitigates undesired diffusion from underlying layersthere through. The diffusion barrier layer is comprised of a suitablediffusion blocking material, such as TiAlN, and the like. In oneexample, the diffusion barrier layer is formed as TiAlN by a physicalvapor deposition process. It is noted that alternate aspects of theinvention can omit the bottom electrode diffusion barrier layer.

A bottom electrode is then formed on/over the bottom electrode diffusionbarrier layer at block 406. The bottom electrode is comprised of aconductive material, is typically stable in oxygen, and has a suitablethickness. Some other examples of possible materials that can beemployed for the bottom electrode include, for example, a noble metal orconductive oxide such as iridium, iridium oxide, Pt, Pd, PdOx, Au, Ru,RuO_(x), Rh, RhO_(x), LaSrCoO₃, (Ba,Sr)RuO₃, LaNiO₃ or any stack orcombination thereof. One example of a suitable thickness for the bottomelectrode is around 30-100 nm thick. An example of a suitable depositiontechnique for the bottom electrode is sputter or reactive sputterdeposition or chemical vapor deposition, however other depositionprocesses can be employed.

A ferroelectric layer is formed over the bottom electrode at block 408.The ferroelectric layer has a suitable thickness, for example about 50to about 150 nm, and is comprised of a ferroelectric material. Someexamples of suitable ferroelectric materials that can be employed in theferroelectric layer include Pb(Zr,Ti)O₃ PZT (lead zirconate titanate),doped PZT with donors (Nb, La, Ta) acceptors (Mn, Co, Fe, Ni, Al) and/orboth, PZT doped and alloyed with SrTiO3, BaTiO3 or CaTiO3, strontiumbismuth tantalate (SBT) and other layered perovskites such as strontiumbismuth niobate tantalate (SBNT) or bismuth titanate, BaTiO3, PbTiO3,Bi2TiO3, and the like. Generally, the ferroelectric material exhibitsferroelectric properties and has a suitable polarization and processingtemperature.

One example of a suitable deposition process for the ferroelectric layeris metal organic chemical vapor deposition (MOCVD). MOCVD can beemployed for thin films (<100 nm) and permits the film thickness to bescaled without significant degradation of switched polarization andcoercive field, yielding, for example, PZT films with a low operatingvoltage and large polarization values. In addition, the reliability ofthe MOCVD formed ferroelectric layers is better than that generallyobtained using other deposition techniques, particularly with respect toimprint/retention.

A top electrode is formed on/over the ferroelectric layer at block 410.The top electrode is comprised of a conductive material and has asuitable thickness. Some examples of suitable materials include Ir,IrO_(x), noble metals, alloys thereof, and the like. Some examples ofother suitable materials include Pt, Pd, PdOx, Au, Ru, RuO_(x), Rh,RhO_(x), LaSrCoO₃, (Ba,Sr)RuO₃, LaNiO₃ or any stack or combinationthereof. One example of a suitable thickness for the top electrode isaround 30-100 nm thick. An example of a suitable deposition techniquefor the top electrode is sputter or reactive sputter deposition orchemical vapor deposition, however other deposition processes can beemployed.

Continuing, a hard mask is formed over the top electrode at block 412.The hard mask is comprised of a material, such as TiN, TiAlN, and thelike. The hard mask can comprise one or more layers and is patterned soas to remain over a target stack region and expose other portions of thetop electrode. It is noted that the hard mask can be removed at a laterstage of fabrication or can remain in place, for example, to act as adiffusion barrier. As one example, photoresist can be employed topattern deposited hard mask material to yield the hard mask over thetarget stack region.

The top electrode is etched at block 414 by a suitable etch processemploying the hard mask for selectivity. The suitable etch process isselective to the hard mask material and the top electrode material. Fornoble metals, such as Ir, a suitable etch process is a high temperatureetch chemical etch process. Such an etch process can permit relativelysteep sidewall profiles etch selectivity to other layers such as thehard mask.

One exemplary etch chemistry for these noble metal electrodes is Cl₂+O₂or Cl₂+CO. Other gas additives such as N₂ or Ar can also be addedalthough Ar in particular is usually not a good choice because it onlyetches by physical mechanisms and not chemical. In one example, the topelectrode etch is Cl₂+O₂+N₂. A suitable etch process can also use a highdensity plasma (1200 W, for example) and an intermediate substrate bias(300 W chuck) at intermediate pressures (10 mTorr) and elevatedtemperatures (350-400 C). In another example, BCl3 is employed with Arat intermediate pressures at relatively low temperatures (about 60degrees Celsius) for the etch.

The ferroelectric layer is etched at block 416 by a suitable etchprocess also employing the hard mask for selectivity. The suitable etchprocess is selective to the ferroelectric layer and the hard mask. Inone example, a suitable etch process is based on a Cl₂+Fluorinegas+oxidizer (O₂ or CO for example) with Ar or N₂. For example,Cl₂+O₂+CH₂F₂ (75/35/12) at a high chuck temperature (350 C-400 C), at amedium pressure (10 mTorr), at a high density plasma (1200 W), and alarge substrate bias (450 W RF on chuck). In another example, a suitableetch process for the ferroelectric layer is based on Cl₂+O₂+CH₂F₃ at apressure of 10 mTorr, at a high density plasma (1200 W), and a largesubstrate bias (450 W), and at a temperature of about 150 degreesCelsius. It is appreciated that aspects of the present invention caninclude other suitable etch processes for the ferroelectric layer.

The bottom electrode is then etched at block 418 by a suitable etchprocess with the hard mask employed for selectivity. The suitable etchprocess is selective to the bottom electrode material and the hard maskmaterial and can employ the same etch chemistry as used for etching thetop electrode.

It is appreciated that a single etch process can be employed to etch thetop electrode, the ferroelectric layer, and the bottom electrode.

The etching of the top electrode and the bottom electrode can result inre-deposition of electrode material and other low vapor pressurematerials. If not removed, these re-deposited materials can degradeferroelectric cell performance or even short the top and bottomelectrodes.

The bottom electrode diffusion barrier layer is etched at block 420 byanother suitable etch process. An ash process is typically performedafter the etch of the bottom electrode diffusion barrier layer. In oneexample of a suitable ash process, the ash process employs H₂O—O₂ for aduration of 4 minutes.

A dry clean process is performed on the etched ferroelectric stack atblock 422. The dry clean process removes, for example, contaminants suchas re-deposited conductive material from the top and bottom electrodes.In one example, the dry clean process employs a CF₄/O₂ plasma, whichgenerates isotropic fluoride species that slightly etches theferroelectric layer (PZT) and reacts with other etch debris. It isappreciated that other suitable fluorine based plasmas can also beemployed for the dry clean process.

In one example of a suitable dry clean process that mitigates edgedegradation, the CF₄ is provided at 60 sccm, the O₂ is provided at 2940sccm, for a duration of 60 seconds at a temperature of 60 degreesCelsius and at a power of 100 W. However, it is appreciated that otherprocess conditions can be employed.

A wet etch/clean process is then performed at block 424. The wetetch/clean process includes an acid clean, such as phosphoric acid(H₃PO₄) and the like. The wet etch/clean process can be followed by anash process. The phosphoric acid removes residual reaction products fromthe dry clean process. The ash process is an oxygen based processperformed for a suitable duration and temperature. In one example, thesuitable ash process is performed for a duration of about 3 minutes andat a temperature of about 325 degrees Celsius, however other durationsand/or temperatures can be employed. Subsequently, sidewalls, such asaluminum oxide sidewalls, can be formed on lateral edges of theferroelectric stack. Other fabrication processes can be performed tocomplete fabrication of the device.

FIG. 5 is a flow diagram illustrating a method 500 of fabricating aferroelectric memory device in accordance with an aspect of the presentinvention. The method 500 employs a dry clean during etching of theferroelectric stack in order to mitigate performance degradation and/orfailure of ferroelectric memory cells, unlike the method 400 thatemploys a dry clean process after etching the ferroelectric stack.Portions of the method 500 are similar to portions of the method 400described above and the discussion of the method 400 can be referencedfor further information.

It is appreciated that portions of the method 400 can be performed in anorder varied from that introduced below. Additionally, other portions ofthe detailed description can be referenced for additional detail andsupport of the method 500. Furthermore, it is noted that processes inaddition to those described can be employed in formation of theferroelectric memory device and that some of the blocks below can beomitted in alternate aspects of the invention.

Beginning at block 502, an interlevel dielectric layer is formed on/overa semiconductor body or substrate and contacts are formed in theinterlevel dielectric layer. The contacts are comprised of a conductivematerial, for example, tungsten (W) contacts, and are typically formedtherein with a barrier layer, such as TiN, disposed there between toavoid oxidation of the contacts.

A bottom electrode diffusion barrier layer is formed over the interlayerdielectric at block 504. The diffusion barrier layer is electricallyconductive and mitigates undesired diffusion from underlying layersthere through. The diffusion barrier layer is comprised of a suitablediffusion blocking material, such as TiAlN, and the like. It is notedthat alternate aspects of the invention can omit the bottom electrodediffusion barrier layer.

A bottom electrode is then formed on/over the bottom electrode diffusionbarrier layer at block 506. The bottom electrode is comprised of aconductive material, is typically stable in oxygen, and has a suitablethickness. Some other examples of possible materials that can beemployed for the bottom electrode include, for example, a noble metal orconductive oxide such as iridium, iridium oxide, Pt, Pd, PdOx, Au, Ru,RuO_(x), Rh, RhO_(x), LaSrCoO₃, (Ba,Sr)RuO₃, LaNiO₃ or any stack orcombination thereof.

A ferroelectric layer is formed over the bottom electrode at block 508.The ferroelectric layer has a suitable thickness, for example about 50to about 150 nm, and is comprised of a ferroelectric material. Someexamples of suitable ferroelectric materials that can be employed in theferroelectric layer include Pb(Zr,Ti)O₃ PZT (lead zirconate titanate),doped PZT with donors (Nb, La, Ta) acceptors (Mn, Co, Fe, Ni, Al) and/orboth, PZT doped and alloyed with SrTiO3, BaTiO3 or CaTiO3, strontiumbismuth tantalate (SBT) and other layered perovskites such as strontiumbismuth niobate tantalate (SBNT) or bismuth titanate, BaTiO3, PbTiO3,Bi2TiO3, and the like. Generally, the ferroelectric material exhibitsferroelectric properties and has a suitable polarization and processingtemperature.

A top electrode is formed on/over the ferroelectric layer at block 510.The top electrode is comprised of a conductive material and has asuitable thickness. Some examples of suitable materials include Ir,IrO_(x), noble metals, alloys thereof, and the like. Some examples ofother suitable materials include Pt, Pd, PdOx, Au, Ru, RuO_(x), Rh,RhO_(x), LaSrCoO₃, (Ba,Sr)RuO₃, LaNiO₃ or any stack or combinationthereof. Continuing, a hard mask is formed over the top electrode atblock 512. The hard mask is comprised of a material, such as TiN, TiAlN,and the like. The hard mask can comprise one or more layers. The hardmask is patterned so as to remain over a target stack region and exposeother portions of the top electrode. It is noted that the hard mask canbe removed at a later stage of fabrication or can remain in place, forexample, to act as a diffusion barrier.

The top electrode is etched at block 514 by a suitable etch processemploying the hard mask for selectivity. The suitable etch process isselective to the hard mask material and the top electrode material. Fornoble metals, such as Ir, an example of a suitable etch process is ahigh temperature chemical etch process.

The ferroelectric layer is etched at block 516 by a suitable etchprocess also employing the hard mask for selectivity. The suitable etchprocess is selective to the ferroelectric layer and the hard mask. Inone example, a suitable etch process is based on a Cl₂+Fluorinegas+oxidizer (O₂ or CO for example) with Ar or N₂. For example,Cl₂+O₂+CH₂F₂ (75/35/12) at a high chuck temperature (350 C-400 C), at amedium pressure (10 mTorr), at a high density plasma (1200 W), and alarge substrate bias (450 W RF on chuck). It is appreciated that aspectsof the present invention can include other suitable etch processes forthe ferroelectric layer.

The etching of the top electrode and the ferroelectric layer can resultin re-deposition of electrode material and/or other materials. If notremoved, these re-deposited materials can degrade ferroelectric cellperformance.

A dry clean process is performed on the etched ferroelectric stack atblock 518. The dry clean process removes, for example, contaminantsand/or debris such as re-deposited conductive material from the top andbottom electrodes. In one example, the dry clean process employs aCF₄/O₂ plasma, which generates isotropic fluoride species that slightlyetches the ferroelectric layer (PZT) and reacts with other etch debris.

In one example of a suitable dry clean process that mitigates edgedegradation, the CF₄ is provided at 20 sccm, the O₂ is provided at 98sccm, and Ar is provided at 20 sccm with a source power of 1400 W and abias power of 450 W. However, it is appreciated that other processconditions can be employed.

The bottom electrode is then etched at block 520 with the hard maskemployed for selectivity. A suitable etch process selective to thebottom electrode material and the hard mask material is employed. Theetch process can employ the same etch chemistry as used for etching thetop electrode.

The bottom electrode diffusion barrier layer is etched at block 522 byanother suitable etch process. An ash process is typically performedafter the etch of the bottom electrode diffusion barrier layer. In oneexample of a suitable ash process, the ash process employs H₂O—O₂ for aduration of 5 minutes.

A wet etch/clean process is then performed at block 524. The wetetch/clean process includes an acid clean and can be followed by an ashprocess. As an example, phosphoric acid can remove residual reactionproducts from the dry clean process. The ash process is an oxygen basedprocess, in one example, performed for a duration of about 3 minutes andat a temperature of about 450 to about 550 degrees Celsius.Subsequently, sidewalls, such as aluminum oxide sidewalls, can be formedon lateral edges of the ferroelectric stack. Other fabrication processescan be performed to complete fabrication of the device.

It is appreciated that variations of the method 500 are contemplated inaccordance with the present invention. For example, a second dry cleancould also be performed after etching the bottom electrode and/or thediffusion barrier in addition to the dry clean performed at block 518.

FIGS. 6A to 6E depict a ferroelectric memory device at various stages offabrication in accordance with an aspect of the present invention. Themethod 400 of FIG. 4, the method 500 of FIG. 5, and/or variationsthereof can be employed to fabricate the device. The ferroelectricmemory device is provided as an example for illustrative purposes. It isappreciated that other ferroelectric memory devices can be fabricated inaccordance with the present invention.

Turning now to FIG. 6A, a cross sectional view of a ferroelectric memorydevice 600 at a stage of fabrication in accordance with an aspect of thepresent invention is provided. The memory device 600 is depicted priorto etching the ferroelectric stack.

The memory device 600 includes one or more semiconductor layers 602,such as a dielectric layer, interlevel dielectric layer, interlayerdielectric layer, silicon layer, and the like. A contact barrier layer604 and a contact 606 are typically formed within the layers 602. In oneexample, the contact 606 is comprised of tungsten.

A bottom electrode diffusion barrier layer 608 is formed over/on the oneor more semiconductor layers 602. The diffusion barrier layer 608 iscomprised of a suitable diffusion blocking material, such as TiAlN andthe like. The diffusion barrier layer 608 is also comprised ofconductive material. It is noted that devices formed in accordance withaspects of the present invention do not necessarily require a bottomelectrode diffusion barrier layer.

A bottom electrode 610 is formed on the bottom electrode diffusionbarrier layer 608. The bottom electrode 610 is comprised of a suitableconductive material, such as iridium, iridium oxide, other noble metals,and the like and has a suitable thickness.

A ferroelectric layer 612 is formed on the bottom electrode 610. Theferroelectric layer 612 is comprised of a ferroelectric material, suchas PZT, that exhibits ferroelectric properties. Such materials includesuitable polarization characteristics and processing temperature.

A top electrode 614 is formed on the ferroelectric layer 612. The topelectrode 614 is also comprised of a suitable conductive material, suchas iridium, iridium oxide, other noble metals, and the like and has asuitable thickness.

A hard mask layer 616 is formed on the top electrode 614. The hard masklayer 616 facilitates etching of the ferroelectric stack and can also bea diffusion barrier, for example, by blocking hydrogen. Some examples ofsuitable materials for the hard mask layer 616 include TiN, TiAlN, andthe like.

Turning now to FIG. 6B, another cross sectional view of a ferroelectricmemory device 600 at a stage of fabrication in accordance with an aspectof the present invention is provided. The hard mask layer 616 has beenpatterned so as to expose portions of the underlying layers whilecovering a target ferroelectric stack portion. In one example, aphotoresist patterning process is employed to define the hard mask layer616.

FIG. 6C shows yet another cross section view of the ferroelectric memorydevice 600 at a stage of fabrication in accordance with an aspect of thepresent invention. Here, the ferroelectric stack has been partiallyetched.

One or more etch processes have been employed to selectively etch thetop electrode 614 and the ferroelectric layer 612, as described above.Thereafter, a dry clean 620 is performed to mitigate edge defects. Thedry clean 620 can remove contaminants and/or debris, such asre-deposited or displaced conductive or ferroelectric materials. In oneexample, the dry clean 620 employs a CF₄/O₂ plasma, which generatesisotropic fluoride species that slightly etches the ferroelectric layerand reacts with other etch debris.

FIG. 6D depicts another cross section view of the ferroelectric memorydevice at a stage of fabrication in accordance with an aspect of thepresent invention. At this stage, the ferroelectric stack has beenetched. One or more suitable etch processes are employed to selectivelyremove portions of the bottom electrode layer 610 and the bottomelectrode diffusion layer 608.

Again, a dry clean 622 is performed to mitigate edge defects. The dryclean 622 can remove contaminants and/or debris, such as re-deposited ordisplaced conductive materials from the top electrode 614, the bottomelectrode 610, and the bottom electrode diffusion barrier layer 608 orferroelectric materials from the ferroelectric layer 612. In oneexample, the dry clean 622 employs a CF4/O2 plasma, which generatesisotropic fluoride species that slightly etches the ferroelectric layerand reacts with other etch debris.

It is noted that ferroelectric memory devices formed in accordance withaspects of the present invention can employ one or both of the dry cleanprocesses 620 and 622.

FIG. 6E illustrates yet another cross section view of the ferroelectricmemory device at a stage of fabrication in accordance with an aspect ofthe present invention. A wet etch process and a ash process can beperformed to facilitate removal of debris or contaminants. For example,a phosphoric acid can be employed as a wet etch/clean process to removeresidual reaction products from the dry clean processes 620 and 622.

Although the invention has been shown and described with respect to acertain aspect or various aspects, it is obvious that equivalentalterations and modifications will occur to others skilled in the artupon the reading and understanding of this specification and the annexeddrawings. In particular regard to the various functions performed by theabove described components (assemblies, devices, circuits, etc.), theterms (including a reference to a “means”) used to describe suchcomponents are intended to correspond, unless otherwise indicated, toany component which performs the specified function of the describedcomponent (i.e., that is functionally equivalent), even though notstructurally equivalent to the disclosed structure which performs thefunction in the herein illustrated exemplary embodiments of theinvention. In addition, while a particular feature of the invention mayhave been disclosed with respect to only one of several aspects of theinvention, such feature may be combined with one or more other featuresof the other aspects as may be desired and advantageous for any given orparticular application. Also, the term “exemplary” is intended as anexample, not as a best or superior solution. Furthermore, to the extentthat the term “includes” is used in either the detailed description orthe claims, such term is intended to be inclusive in a manner similar tothe term “comprising.”

1. A method of fabricating a ferroelectric memory device, the methodcomprising: forming a bottom electrode over one or more semiconductorlayers; forming a ferroelectric layer over the bottom electrode; forminga top electrode over the ferroelectric layer; selectively etching thetop electrode; selectively etching the ferroelectric layer; performing adry clean process subsequent to etching the ferroelectric layer with aplasma that generates isotropic fluoride species that react with debristo form residual reaction products; and selectively etching the bottomelectrode subsequent to performing the dry clean process.
 2. The methodof claim 1, further comprising performing a wet clean process withphosphoric acid to remove the residual reaction products subsequent toperforming the dry clean process.
 3. The method of claim 1, furthercomprising forming a bottom electrode diffusion barrier layer over oneor more semiconductor layers prior to forming the bottom electrode. 4.The method of claim 1, further comprising forming a hard mask on the topelectrode covering a target portion of the top electrode prior toetching the top electrode.
 5. The method of claim 1, further comprisingperforming a second dry clean subsequent to selectively etching thebottom electrode diffusion barrier layer.
 6. The method of claim 1,wherein the plasma is comprised of CF₄/O₂.
 7. The method of claim 1,wherein the plasma is comprised of CF₄/O₂/Ar.